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A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link

Authors
N. Baniasadi, A. Townley, S. Krishnamurthy, A. M. Niknejad, & E. Alon
Pub Type
Conference Paper
URL
https://ieeexplore.ieee.org/document/9075890
Forum

2020 IEEE Custom Integrated Circuits Conference (CICC)

Joint Publication?
ComSenTer Team
Team Link
Analog and Mixed Design
ComSenTer
Center for Converged TeraHertz Communications and Sensing
University of California
Santa Barbara, CA, USA

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