The demonstration of the multi-user MIMO (MU-MIMO) system is realized using custom CMOS transceivers at 140 GHz (“Head Module”), CMOS baseband signal acquisition, equalization, DSP, and high speed SerDes links (“Spine Module”) to realize a distributed and scalable multi-user beam forming system. The chips are co-packaged and integrated with III-V InP / GaN front-end modules to improve range and sensitivity.
Our team works closely with UC Santa Barbara and UC San Diego to realize the full solution. Our team is responsible for the CMOS chipset that will implement the Hydra distributed beam forming architecture. Santa Barbara is focusing on the front-end module for high power and 140 GHz packaging/antenna design, and San Diego is focusing on the 2D phased-array module for the handset.